Portable Fiber Laser Marking Machine
Laser marking machine production line: an optical fiber laser marking machine, CO2 lasermarking machine, laser marking machine, green laser marking machine, UV lasermarking machine, multi-station laser marking machine, fiber laser, imported fiber lasers, CO2 lasers, semiconductor lasers ...... and provide various types of fiber lasers,semiconductor lasers repair and replacement, CO2 lasers and other services ......inflatable precision laser micromachining product lines: 600W CW fiber laser weldingmachine, ultrafast picosecond laser micro processing system, double sapphirepicosecond laser drilling, cutting machine, ITO, silver laser etching machines, LEDsapphire laser scribing machine, LED ceramic substrate laser cutting, dicing machine, HDI-speed picosecond laser drilling machine, FPC UV laser cutting machine, laser etching machine metal thin film circuits, semiconductor wafer picosecond laser scribing machine, cell phone cover glass laser cutting, drilling machine, cell phone film laser cutting machine, multi-station UV laser marking machine ... ...
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Portable Fiber Laser Marking machine (portable, integrated, split, rotary, flight type ......)
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Plastic translucent keys, IC chips, digital product components, precision machinery, jewelry, sanitary ware, measuring and cutting tools, clocks, glasses, electrical appliances, electronic components, hardware accessories, hardware tools, mobile communications components, auto parts, plastic products, medical equipment, building materials, pipes and other high-precision product identification.
Metal and nonmetal materials, high hardness alloys, oxides, plating, coating, ABS, epoxy, ink, plastics and the like.
Laser machining principle: Laser marking is the use of high energy density laser beam, local irradiation on the surface, so that the surface material or color changes rapidly vaporized, thereby exposing the underlying substance, or cause physical changes in the surface chemical substances and carve traces, or by light burned portion of the material, showing the required etched graphics, text.
1. The use of third-generation solid fiber laser, electro-optical conversion efficiency up to 60%, excellent beam quality M2 <1.4
2. The excellent beam quality, creating ultra-fine marking effect
3. The use of original high-speed scanning head. Marking speed fast, it is more common YAG and DP semiconductor marking machine 3-6 times, thereby saving you expensive labor wages
The air-cooled, no supplies, maintenance-free for five years, the use of low cost. Energy saving, the whole power is only 500W. Compared to lamp-pumped semiconductor laser marking machine can save electricity each year about 20,000 yuan.
5. integrated modular design, easy maintenance, compact. Saving you valuable plant space.
6. The mark of environmental protection, a permanent non-fading, RoHS compliant.
1. To receive a variety of BMP, JPG, DXF, PLT, AI and other formats
2. automatically generate a variety of serial number, production date, one-dimensional codes, two-dimensional code
3. support flight marking
4. Support the rotation marking
5. Support large area XY platform automatic segmentation marking
|Laser output power||≤10W||≤20W|
|M2 beam quality||＜1.4||＜1.8|
|Q-switched laser frequency||20kHz~100kHz||20kHz~200kHz|
|Standard engraving range||110mm×110mm||110mm×110mm|
|Optional engraving area||70mm×70mm
|Minimum line width||0.01mm||0.01mm|
|Electricity demand||Single-phase AC 90-250V / 50Hz 5A||Single-phase AC 90-250V / 50Hz 10A|
|Engraving speed||700 characters / s (singlet Roman font character height 1mm)||1000 characters / s (singlet Roman font character height 1mm)|
|Host system size||300mm × 500mm × 800mm||300mm × 500mm × 800mm|
|cooling system||Air Cooled||Air Cooled|